Opportunity Information: Apply for 2024 NIST CHIPS NAPMP 01
The FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates funding opportunity is a discretionary federal grant/assistance program run by the National Institute of Standards and Technology (NIST) under the CHIPS Research and Development (CHIPS R&D) Program. Its purpose is to push forward semiconductor research and development in ways that strengthen U.S. competitiveness, with this particular solicitation focusing on a very specific and strategic bottleneck in the microelectronics supply chain: advanced packaging substrates and the materials used to make them. In practical terms, the government is looking to fund new R&D efforts that can help build and speed up domestic capability to design, develop, and manufacture the substrates and substrate materials that modern chip packages rely on, since packaging is increasingly central to performance, power efficiency, and system integration.
This Notice of Funding Opportunity (NOFO) is described as the first funding announcement under the broader CHIPS R&D Program, which signals that it is meant to set direction and momentum for later CHIPS R&D investments. The emphasis on "advanced packaging substrates and substrate materials" reflects how packaging has shifted from being a back-end assembly step to a leading-edge technology area, especially as the industry pursues chiplets, heterogeneous integration, high-bandwidth interconnects, and other advanced architectures. Substrates are the foundational platform that connects silicon devices to the rest of the system, and improvements in substrate materials, manufacturing processes, reliability, and scaling can directly translate into higher-performing and more manufacturable microelectronics systems. This opportunity is therefore aimed at R&D that results in credible, scalable pathways to domestic production capacity, rather than purely academic exploration.
Eligibility is broad but still clearly bounded. Applicants can include domestic for-profit organizations, domestic non-profit organizations, and accredited U.S. institutions of higher education, including community colleges and technical colleges. Governmental entities are also eligible, including state, local, territorial, and Indian tribal governments. The opportunity is listed under Assistance Listing (formerly CFDA) number 11.042, and the activity category is Science and Technology and other Research and Development, consistent with a technology maturation and capability-building focus.
There are notable submission and teaming limits that applicants need to plan around early. Each eligible applicant may submit only one full application under this NOFO, which means organizations with multiple internal teams must consolidate their approach into a single proposal. In addition, an entity cannot be included as a subrecipient on more than two applications, a restriction that affects teaming strategies and the ability of highly specialized partners (for example, a unique materials supplier, university lab, or process development group) to participate widely across many consortia. These constraints are intended to reduce proposal duplication, spread participation, and keep the competition manageable.
Key administrative details from the listing include the opportunity title "FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates" and funding opportunity number "2024 NIST CHIPS NAPMP 01." The agency is NIST, the opportunity category is Discretionary, and the funding instrument type is listed as "Other." The original closing date is July 3, 2024, and the posting (creation) date is February 28, 2024. The public listing does not provide an award ceiling or expected number of awards in the provided source fields, so those specifics would need to be confirmed in the full NOFO documentation.
Overall, this grant opportunity is best understood as a CHIPS Act-era investment aimed at strengthening the U.S. advanced packaging ecosystem by funding targeted R&D that can translate into real domestic capacity for substrate technologies. The government is signaling that packaging substrates and materials are not a supporting detail but a critical enabling technology for next-generation microelectronics, and it is seeking proposals that can move the needle on capability, scale, and competitiveness within the United States.Apply for 2024 NIST CHIPS NAPMP 01
- The National Institute of Standards and Technology in the science and technology and other research and development sector is offering a public funding opportunity titled "FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates" and is now available to receive applicants.
- Interested and eligible applicants and submit their applications by referencing the CFDA number(s): 11.042.
- This funding opportunity was created on 2024-02-28.
- Applicants must submit their applications by 2024-07-03. (Agency may still review applications by suitable applicants for the remaining/unused allocated funding in 2026.)
- Eligible applicants include: Others.
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FAQs: FY2024 CHIPS R&D NAPMP Materials & Substrates (2024 NIST CHIPS NAPMP 01)
What is this funding opportunity?
This is the FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates funding opportunity. It is a discretionary federal grant/assistance program run by the National Institute of Standards and Technology (NIST) under the CHIPS Research and Development (CHIPS R&D) Program.
What is the main purpose of the program?
The program aims to advance semiconductor research and development in ways that strengthen U.S. competitiveness. This specific solicitation targets advanced packaging substrates and the materials used to make them, with an emphasis on R&D that supports credible, scalable pathways to domestic production capacity.
Why are materials and substrates for advanced packaging a focus area?
The opportunity focuses on a strategic bottleneck in the microelectronics supply chain: advanced packaging substrates and substrate materials. Substrates act as the foundational platform connecting silicon devices to the rest of the system, and improvements can directly impact performance, power efficiency, system integration, manufacturability, reliability, and scaling.
How does this relate to current microelectronics trends (chiplets, heterogeneous integration, etc.)?
The solicitation reflects how packaging has become a leading-edge technology area as the industry pursues chiplets, heterogeneous integration, high-bandwidth interconnects, and other advanced architectures. Substrate technology is central to enabling these approaches.
What kinds of work is NIST looking to fund under this NOFO?
Based on the description provided, NIST is looking to fund new R&D efforts that help build and accelerate domestic capability to design, develop, and manufacture advanced packaging substrates and the materials used to produce them. The framing emphasizes moving toward scalable domestic production capability rather than purely academic exploration.
Is this the first CHIPS R&D funding announcement?
Yes. The NOFO is described as the first funding announcement under the broader CHIPS R&D Program, suggesting it is intended to help set direction and momentum for later CHIPS R&D investments.
Who is the sponsoring agency?
The sponsoring agency is the National Institute of Standards and Technology (NIST), operating under the CHIPS Research and Development (CHIPS R&D) Program.
What is the official opportunity title?
The official opportunity title is "FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates."
What is the funding opportunity number?
The funding opportunity number is "2024 NIST CHIPS NAPMP 01."
What is the Assistance Listing (CFDA) number for this opportunity?
The Assistance Listing (formerly CFDA) number is 11.042.
What is the activity category for this opportunity?
The activity category is "Science and Technology and other Research and Development."
What type of opportunity is this (discretionary vs. formula)?
The opportunity category is listed as Discretionary.
What is the funding instrument type?
The funding instrument type is listed as "Other."
Who is eligible to apply?
Eligibility includes:
- Domestic for-profit organizations
- Domestic non-profit organizations
- Accredited U.S. institutions of higher education (including community colleges and technical colleges)
- Governmental entities, including state, local, territorial, and Indian tribal governments
Can an organization submit more than one application?
No. Each eligible applicant may submit only one full application under this NOFO. Organizations with multiple internal teams would need to consolidate into a single proposal.
Are there limits on participating as a subrecipient?
Yes. An entity cannot be included as a subrecipient on more than two applications. This can affect teaming plans, especially for specialized partners that might otherwise participate across many different consortia.
Why do the application and subrecipient limits matter for teaming strategy?
The one-application-per-applicant rule and the subrecipient limit (no more than two applications) can constrain how consortia are formed and how often highly sought-after partners can participate. These limits are intended to reduce proposal duplication, spread participation, and keep the competition manageable.
What is the deadline to apply?
The original closing date listed is July 3, 2024.
When was the opportunity posted?
The posting (creation) date listed is February 28, 2024.
Does the public listing include the award ceiling or the expected number of awards?
No. The provided listing fields do not include an award ceiling or the expected number of awards. Those details would need to be verified in the full NOFO documentation.
What is the program trying to achieve for the United States?
It is positioned as a CHIPS Act-era investment intended to strengthen the U.S. advanced packaging ecosystem by funding targeted R&D that can improve domestic capability, scale, and competitiveness in substrate technologies and the materials used to make them.
How should applicants interpret the emphasis on "credible, scalable pathways"?
The language signals a focus on R&D that can translate into real-world, manufacturable outcomes and support domestic production capacity, not just exploratory or purely academic research.
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